LOW PRESSURE MOULDING
Low pressure moulding is a manufacturing process used to encapsulate and protect electronic components, cables, and connectors. The process involves melting a thermoplastic material and injecting it into a mould at a low pressure and temperature, typically around 100-150°C and 3-10 bar. This ensures that the electronic components, cables, and connectors are not damaged during the encapsulation process.
Low pressure moulding is used in a wide range of industries, including automotive, aerospace, medical devices, and consumer electronics. It provides an efficient way to protect electronic components, cables, and connectors from environmental factors such as moisture, dust, and vibration.
Our Low Pressure Moulding capabilities;
Complete in-house mould tool design capabilities
Can run both high and low volume production
Encapsulate and protect electronic components, cables, and connectors.
Full testing facilities
LPM can be used as a substitute for epoxy potting processes
Cable First has been low pressure moulding (LPM) to the highest quality for over 10 years, and has continually invested in the latest machines and technologies. This means customers can trust us with outsourcing their LPM requirements, reducing their manufacturing times and costs.